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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies / Edition 1
Barnes and Noble
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies / Edition 1
Current price: $150.95
Barnes and Noble
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies / Edition 1
Current price: $150.95
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- Discusses specific company standards and their development results
- Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging
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