Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to evolve. A step change in package requirements came with the introduction of the micro-electromechanical system (MEMS), whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on test methods for hermetic packaging for the MEMS and microelectronics industries, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today's package types. The authors cover the history and development of packaging, with a view to understanding hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.