Home

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages / Edition 1

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages / Edition 1

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages / Edition 1

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages / Edition 1

Unfortunately, this item is no longer available, but we found some similar items you might like.

You May Also Like

Structural and Stress Analysis / Edition 4

Loading Inventory...

Structural and Stress Analysis / Edition 4

Barnes and Noble

Handbook of Thermoplastic Elastomers / Edition 2

Loading Inventory...

Handbook of Thermoplastic Elastomers / Edition 2

Barnes and Noble

Polymers for Packaging Applications / Edition 1

Loading Inventory...

Polymers for Packaging Applications / Edition 1

Barnes and Noble

Elasto-Plastic and Damage Analysis of Plates and Shells / Edition 1

Loading Inventory...

Elasto-Plastic and Damage Analysis of Plates and Shells / Edition 1

Barnes and Noble

Keep Shopping

on sale.jpg

On Sale

new in.jpg

New In

Men

Women

baby abd kids.jpg

Baby and Kids

Beauty

Jewelry

More About Barnes and Noble at The Summit

With an excellent depth of book selection, competitive discounting of bestsellers, and comfortable settings, Barnes & Noble is an excellent place to browse for your next book.

Store Info